DocumentCode
381782
Title
New substrates for MOEMS
Author
Reiche, M. ; Hiller, E. ; Stolze, D.
Author_Institution
Max-Planck Inst. fur Mikrostrukturphysik, Halle, Germany
Volume
1
fYear
2002
fDate
2002
Firstpage
607
Abstract
Bonded hydrophobic wafer pairs (PEW wafers) are applied as alternative substrates for optical devices (pin-diodes and complex MOEMS). Important parameters of diodes are analysed at temperatures up to 160°C (dark current, photocurrent, CV-curves, rise time). Diodes produced on bonded hydrophobic wafer pairs show a similar or better behaviour than components prepared on the standard epitaxial wafers.
Keywords
dark conductivity; micro-optics; p-i-n diodes; photodetectors; wafer bonding; 20 to 160 degC; CV-curves; MOEMS; bonded hydrophobic wafer pairs; dark current; photocurrent; pin-diodes; rise time; Computational Intelligence Society; Conductivity; Diodes; Optical materials; Photodetectors; Silicon; Substrates; Surface cleaning; Surface contamination; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2002. Proceedings of IEEE
Print_ISBN
0-7803-7454-1
Type
conf
DOI
10.1109/ICSENS.2002.1037170
Filename
1037170
Link To Document