DocumentCode :
381818
Title :
Micro-electromechanical systems and test results of SiC MEMS for high-g launch applications
Author :
Katulka, Gary L.
Author_Institution :
U.S. Army Res. Lab., APG, MD, USA
Volume :
2
fYear :
2002
fDate :
2002
Firstpage :
1134
Abstract :
Micro-electromechanical systems or MEMS are typically used for the measurement of physical phenomena associated with gun launched projectiles and other smart munitions. These devices generally experience not only the harsh environment encountered during initial shock and vibration at gun launch, but also the extremes of high temperature, high pressure and in some cases large electromagnetic fields associated with the launching mechanisms. This paper describes the various types of sensor requirements and characteristics for modern smart weapons, especially those of MEMS and in particular recent experimental results with silicon carbide MEMS pressure sensors.
Keywords :
intelligent sensors; intelligent structures; microsensors; pressure sensors; projectiles; silicon compounds; weapons; wide band gap semiconductors; MEMS; SiC; electromagnetic fields; gun launched projectiles; harsh environment; high-g launch applications; micro-electromechanical systems; pressure; pressure sensors; shock; smart munitions; temperature; vibration; Electric shock; Electromagnetic measurements; Intelligent sensors; Microelectromechanical systems; Micromechanical devices; Projectiles; Sensor phenomena and characterization; Silicon carbide; System testing; Weapons;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2002. Proceedings of IEEE
Print_ISBN :
0-7803-7454-1
Type :
conf
DOI :
10.1109/ICSENS.2002.1037273
Filename :
1037273
Link To Document :
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