Title :
Polishing slurry for Ni-P plated substrates suitable for over 80Gbit/in/sup 2/ recording density
Author :
Oshima, Y. ; Fujii, S. ; Kitayama, H. ; Suenaga, K. ; Hagihara, T.
Author_Institution :
Performance Chem. Res. Labs., Kao Corp., Minato, Japan
Abstract :
The reduction of micro-waviness (Wa), roll-off, micro-bump, scratch, and surface residue is required of a substrate for ultrahigh (over 80Gbit/in/sup 2/) magnetic recording density. Wa for 80Gbit/in/sup 2/ substrates can be achieved in using the slurry including the smaller particle size abrasive and the polishing rate accelerating technique of first polishing slurry (1P-slurry) and second polishing slurry (2P-slurry).
Keywords :
magnetic recording; nickel compounds; polishing; substrates; Ni-P; Ni-P plated substrate; abrasive particle size; micro-bump; micro-waviness; polishing rate accelerating technique; polishing slurry; roll-off; scratch; surface residue; ultrahigh density magnetic recording; Abrasives; Acceleration; Atomic force microscopy; Atomic measurements; Dispersion; Force measurement; Magnetic recording; Rough surfaces; Silicon compounds; Slurries;
Conference_Titel :
Magnetic Recording Conference, 2002. Digest of the Asia-Pacific
Conference_Location :
Singapore
Print_ISBN :
0-7803-7509-2
DOI :
10.1109/APMRC.2002.1037662
