DocumentCode
382071
Title
Distributed face-to-face communication in bottom-up driven technology management-a model for optimizing communication topologies
Author
Kubasa, G. ; Heiss, M.
Author_Institution
Siemens AG Austria, Vienna, Austria
Volume
1
fYear
2002
fDate
2002
Firstpage
234
Abstract
Understanding the communication process in software development organizations has been recognized as the key element to improve the development performance. The paper analyses how different communication topologies-who talks directly to whom and who is informed only via third persons-result in different communication costs and different communication efficiencies. The paper presents a simple cost and efficiency model for face-to-face communication. Based on this model and based on a desired communication benchmark, we are able to compute the optimal communication topology by minimizing the cost/efficiency ratio. The goal is to apply the model for optimizing the knowledge transfer within the knowledge networks at Siemens PSE. These geographically distributed knowledge networks are the key ingredients representing the bottom up component of the technology management process at Siemens PSE.
Keywords
software development management; software houses; technology management; Siemens PSE; bottom-up driven technology management; communication benchmark; communication costs; communication efficiencies; communication topologies; communication topologies optimisation; cost/efficiency ratio minimisation; distributed face-to-face communication; efficiency model; face-to-face communication; geographically distributed knowledge networks; knowledge networks; knowledge transfer; optimal communication topology; software development organizations; technology management process; Communication channels; Costs; Face recognition; Globalization; Investments; Knowledge engineering; Knowledge transfer; Network topology; Programming; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering Management Conference, 2002. IEMC '02. 2002 IEEE International
Print_ISBN
0-7803-7385-5
Type
conf
DOI
10.1109/IEMC.2002.1038426
Filename
1038426
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