DocumentCode :
3828251
Title :
Intercon Week to bring 30,000 to `world´s capital´ of electronics
Volume :
10
Issue :
3
fYear :
1973
Journal_Title :
IEEE Spectrum
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.1973.5216793
Filename :
5216793
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3828251
