Investigation of thermally induced failure mechanisms in integrated spiral planar power passives

Research on the development of electromagnetically integrated passive structures have, in recent years, led to a number of technological improvements such as improved constructional technology. The reliability and physics of failure of these structures have in contrast received little attention. In this paper, the main thermally induced failure mechanisms are investigated experimentally for an integrated LC structure as representative of an integrated power passive. Some lifetime predictions are presented that are based on accelerated life testing, which include thermal cycling and high temperature, high electric-field failure tests.