DocumentCode :
383330
Title :
300 mm ultra thin SOI material using Smart-Cut® technology
Author :
Auberton-Hervé, A.J. ; Maleville, C.
Author_Institution :
SOITEC SA, Crolles, France
fYear :
2002
fDate :
7-10 Oct 2002
Firstpage :
1
Lastpage :
5
Abstract :
We discuss a new ultra thin 300 mm SOI material, Unibond(R), which fulfills industry requirements in terms of uniformity, quality and availability.
Keywords :
ion implantation; oxidation; polishing; semiconductor technology; silicon-on-insulator; 300 mm; low energy implantation; oxidation; polishing; quality; smart-cut technology; ultra thin SOI material; uniformity; Ion implantation; Oxidation; Semiconductor device fabrication; Silicon on insulator technology; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, IEEE International 2002
Print_ISBN :
0-7803-7439-8
Type :
conf
DOI :
10.1109/SOI.2002.1044396
Filename :
1044396
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=383330
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