Title :
MEMS packaging on a budget (fiscal and thermal)
Author :
Cohn, Michael B. ; Roehnelt, Ryan ; Xu, Ji-Hai ; Shteinberg, Alexander ; Cheung, Steven
Author_Institution :
MicroAssembly Technol. Inc., Richmond, CA, USA
Abstract :
MEMS packaging poses novel constraints as compared to conventional IC packaging, and accounts for up to 80% of the cost of the device. A new type of package is proposed, addressing the problems of hermeticity and die singulation, as well as an alternative means of MEMS-IC integration. An organic-free, metal-to-metal bond process enables hermetic sealing at low temperatures. The package has been demonstrated with inertial, resonant, and RF MEMS.
Keywords :
interconnections; microassembling; micromechanical devices; packaging; reliability; seals (stoppers); MEMS packaging; MEMS-IC integration; RF MEMS; die singulation; hermeticity; inertial MEMS; interconnects; low temperature hermetic sealing; low temperature/low cost packaging methods; microassembly; organic-free metal-to-metal bond process; reliability; resonant MEMS; Attenuation; Bonding; Capacitive sensors; Costs; Electric shock; Integrated circuit packaging; Microassembly; Micromechanical devices; Parasitic capacitance; Temperature;
Conference_Titel :
Electronics, Circuits and Systems, 2002. 9th International Conference on
Print_ISBN :
0-7803-7596-3
DOI :
10.1109/ICECS.2002.1045390
