DocumentCode :
3846762
Title :
Performance and Area Scaling Benefits of FD-SOI Technology for 6-T SRAM Cells at the 22-nm Node
Author :
Changhwan Shin;Min Hee Cho;Yasumasa Tsukamoto;Bich-Yen Nguyen;Carlos Mazure;Borivoje Nikolic;Tsu-Jae King Liu
Author_Institution :
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Volume :
57
Issue :
6
fYear :
2010
Firstpage :
1301
Lastpage :
1309
Abstract :
The performance and threshold voltage variability of fully depleted silicon-on-insulator (FD-SOI) MOSFETs are compared against those of conventional bulk MOSFETs via 3-D device simulation with atomistic doping profiles. Compact (analytical) modeling is then used to estimate six-transistor SRAM cell performance metrics (i.e., read and write margins, and read current) at the 22 nm CMOS technology node. The dependences of these metrics on cell ratio, pull-up ratio, and operating voltage are analyzed for FD-SOI versus bulk SRAM cells. Iso-area and iso-yield comparisons are then made to determine the yield and cell-area benefits of FD-SOI technology, respectively. Finally, the minimum operating voltages required for FD-SOI and bulk SRAM cells to meet the six-sigma yield requirement are compared.
Keywords :
"Random access memory","Logic gates","MOSFETs","Measurement","Doping","Semiconductor process modeling","Analytical models"
Journal_Title :
IEEE Transactions on Electron Devices
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2046070
Filename :
5447684
Link To Document :
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