• DocumentCode
    3846807
  • Title

    Understanding Strain-Induced Drive-Current Enhancement in Strained-Silicon n-MOSFET and p-MOSFET

  • Author

    Stefan Flachowsky;Andy Wei;Ralf Illgen;Tom Herrmann;Jan H?ntschel;Manfred Horstmann;Wilfried Klix;Roland Stenzel

  • Author_Institution
    Department of Electrical Engineering, University of Applied Sciences Dresden, Dresden, Germany
  • Volume
    57
  • Issue
    6
  • fYear
    2010
  • Firstpage
    1343
  • Lastpage
    1354
  • Abstract
    Strain greatly affects the electrical properties of silicon because strain changes the energy band structure of silicon. In MOSFET devices, the terminal voltages induce electrical fields, which themselves modulate the electronic band structure and interact with strain-induced changes. Applied electrical fields are used to experimentally study different state-of-the-art local and global strain techniques and reveal the different responses of n- and p-MOSFETs to the different strain techniques. It is shown that p-MOSFETs have more low-lateral-field linear drive-current enhancement and less high-lateral-field saturation drive-current enhancement at both low and high vertical fields. The situation is similar for n-MOSFETs at low vertical fields. However, at high vertical fields, n-MOSFET low-lateral-field linear drive-current enhancement is less than the high-lateral-field saturation drive-current enhancement. The origin for this behavior can be found in the different strain effects on the electronic band structure, which results in effective mass reduction and/or scattering suppression. These, in turn, contribute differently to linear and saturation drive-current enhancements in n- and p-MOSFETs.
  • Keywords
    "MOSFET circuits","Strain","Logic gates","Silicon","Stress","Resistance","Silicon germanium"
  • Journal_Title
    IEEE Transactions on Electron Devices
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2046461
  • Filename
    5453059