Title :
Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
Author :
Świa̧tczak;Bjorn Vermeersch;Gilbert De Mey;Bogusław Wiȩcek;Jȩdrzej ;Mariusz Felczak
Author_Institution :
Institute of Electronics, Technical University of Lodz, lodz, Poland
fDate :
6/1/2010 12:00:00 AM
Abstract :
In this paper, it is outlined how thermal AC measurements can be carried out on a resistor deposited on an electronic substrate. The AC approach enables us to limit ourselves to phase measurements which can be carried out with a much higher precision than amplitude measurements. It will also be demonstrated how the phase measurements at a well-chosen frequency can be used to measure the heat transfer coefficient.
Keywords :
"Heat transfer","Transient response","Phase measurement","Temperature","Thermal resistance","Electronic packaging thermal management","Frequency measurement","Resistors","Numerical simulation","Electronic circuits"
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
DOI :
10.1109/TCAPT.2010.2046326