Title :
Foreword Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages
Author_Institution :
School of Electrical and Computer Engineering, Purdue University
Keywords :
"Special issues and sections","Modeling","High speed integrated circuits"
Journal_Title :
IEEE Transactions on Advanced Packaging
DOI :
10.1109/TADVP.2010.2099155
