• DocumentCode
    3849604
  • Title

    Foreword Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages

  • Author

    Dan Jiao

  • Author_Institution
    School of Electrical and Computer Engineering, Purdue University
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    758
  • Lastpage
    759
  • Keywords
    "Special issues and sections","Modeling","High speed integrated circuits"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2010.2099155
  • Filename
    5671507
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3849604