DocumentCode :
3849803
Title :
Materials processing and reliability of 3D interconnects
Volume :
10
Issue :
4
fYear :
2010
Firstpage :
495
Lastpage :
496
Journal_Title :
IEEE Transactions on Device and Materials Reliability
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2010.2102376
Filename :
5703172
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3849803
