• DocumentCode
    3851401
  • Title

    IC failure analysis: magic, mystery, and science

  • Author

    J.M. Soden;R.E. Anderson;C.L. Henderson

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    14
  • Issue
    3
  • fYear
    1997
  • Firstpage
    59
  • Lastpage
    69
  • Abstract
    Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry´s critical need for new diagnosis and failure analysis paradigms.
  • Keywords
    "Failure analysis","Optical microscopy","Magnetic force microscopy","Atomic force microscopy","Optical interconnections","Photonic integrated circuits","Electron beams","Optical imaging","Packaging","Integrated circuit testing"
  • Journal_Title
    IEEE Design & Test of Computers
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.605998
  • Filename
    605998
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3851401