DocumentCode :
3852743
Title :
High-power CMUTs: design and experimental verification
Author :
F. Yalcin Yamaner;Selim Olcum;H. Kagan Oguz;Ayhan Bozkurt;Hayrettin Koymen;Abdullah Atalar
Author_Institution :
Electronics Engineering Department, Sabanci University, Istanbul, Turkey
Volume :
59
Issue :
6
fYear :
2012
Abstract :
Capacitive micromachined ultrasonic transducers (CMUTs) have great potential to compete with piezoelectric transducers in high-power applications. As the output pressures increase, nonlinearity of CMUT must be reconsidered and optimization is required to reduce harmonic distortions. In this paper, we describe a design approach in which uncollapsed CMUT array elements are sized so as to operate at the maximum radiation impedance and have gap heights such that the generated electrostatic force can sustain a plate displacement with full swing at the given drive amplitude. The pro- posed design enables high output pressures and low harmonic distortions at the output. An equivalent circuit model of the array is used that accurately simulates the uncollapsed mode of operation. The model facilities the design of CMUT parameters for high-pressure output, without the intensive need for computationally involved FEM tools. The optimized design requires a relatively thick plate compared with a conventional CMUT plate. Thus, we used a silicon wafer as the CMUT plate. The fabrication process involves an anodic bonding process for bonding the silicon plate with the glass substrate. To eliminate the bias voltage, which may cause charging problems, the CMUT array is driven with large continuous wave signals at half of the resonant frequency. The fabricated arrays are tested in an oil tank by applying a 125-V peak 5-cycle burst sinusoidal signal at 1.44 MHz. The applied voltage is in- creased until the plate is about to touch the bottom electrode to get the maximum peak displacement. The observed pressure is about 1.8 MPa with -28 dBc second harmonic at the surface of the array.
Keywords :
"Integrated circuit modeling","Silicon","Arrays","Electrodes","Resonant frequency","Impedance","Force"
Journal_Title :
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.2012.2318
Filename :
6217576
Link To Document :
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