DocumentCode :
3853108
Title :
Development of a high- performance transfer mold power module
Author :
Y. Ohki
Volume :
28
Issue :
5
fYear :
2012
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2012.6268447
Filename :
6268447
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3853108
