• DocumentCode
    3853108
  • Title

    Development of a high- performance transfer mold power module

  • Author

    Y. Ohki

  • Volume
    28
  • Issue
    5
  • fYear
    2012
  • Journal_Title
    IEEE Electrical Insulation Magazine
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2012.6268447
  • Filename
    6268447