DocumentCode :
3854090
Title :
It´s All About the Packaging (review of, "LCP for Microwave Packages and Modules" (Pham, A.-V.H., et at; 2012) [Book/Software Reviews]
Author :
Alfy Riddle
Author_Institution :
M/ACOM Technology Solutions
Volume :
13
Issue :
7
fYear :
2012
Firstpage :
81
Lastpage :
82
Keywords :
"Book reviews","Microwave packaging","Packaging","Fabrication","Liquid crystal polymers"
Journal_Title :
IEEE Microwave Magazine
Publisher :
ieee
ISSN :
1527-3342
Type :
jour
DOI :
10.1109/MMM.2012.2216117
Filename :
6355792
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3854090
