DocumentCode :
3854165
Title :
Inside IEEE
Volume :
11
Issue :
3
fYear :
1974
Firstpage :
74
Lastpage :
75
Keywords :
"Awards activities","Materials","Microwave communication","Educational institutions","Engineering profession","Companies"
Journal_Title :
IEEE Spectrum
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.1974.6366401
Filename :
6366401
Link To Document :
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