On-Chip Pulse Transmission in Very High Speed LSI/VLSIS

Using single and coupled metal-insulator-semiconductor (MIS) microstrip line models for interconnection, on-chip pulse delay and crosstalk in very high-speed LSI/VLSIs, are analyzed. The result shows (1) inapplicability of lumped capacitance approximation for interconnection in very high-speed LSI/VLSIs (t _pd <100 ps), (2) superiority of semi-insulating substrates over semi-conducting substrates, (3) importance of driving capability of device to achieve high speeds at LSI/VLSI level and (4) importance of crosstalk in interconnection design.