Title :
Investigation and Evaluation of Low Loss Interconnects on Soft Substrates Clad to Aluminum
Author :
Nelson, T.M. ; Kline, M.D.
Abstract :
The purpose of this study is to provide a comparative evaluation of the quality of RF grounds used with microstrip circuitry on aluminum clad soft substrates. The data obtained by the study is documented and analyzed in the report with appropriate conclusions and recommendations provided.
Keywords :
Aluminum; Assembly; Conducting materials; Copper; Dielectric substrates; Integrated circuit interconnections; Microstrip; Pins; Radio frequency; Springs;
Conference_Titel :
Microwave Symposium Digest, 1985 IEEE MTT-S International
Conference_Location :
St. Louis, MO, USA
DOI :
10.1109/MWSYM.1985.1131937
