DocumentCode
386003
Title
Low Cost MMIC Insertion Using Thick Film Processing
Author
Bettner, A. ; Hundley, B. ; Salisbury, P.
Volume
1
fYear
1987
fDate
May 9 1975-June 11 1987
Firstpage
225
Lastpage
227
Abstract
Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
Keywords
Capacitors; Costs; Glass; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power transmission lines; Resistors; Thick film circuits; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1987 IEEE MTT-S International
Conference_Location
Palo Alto, CA, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1987.1132369
Filename
1132369
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