Title :
Low Cost MMIC Insertion Using Thick Film Processing
Author :
Bettner, A. ; Hundley, B. ; Salisbury, P.
fDate :
May 9 1975-June 11 1987
Abstract :
Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
Keywords :
Capacitors; Costs; Glass; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power transmission lines; Resistors; Thick film circuits; Thick films;
Conference_Titel :
Microwave Symposium Digest, 1987 IEEE MTT-S International
Conference_Location :
Palo Alto, CA, USA
DOI :
10.1109/MWSYM.1987.1132369
