DocumentCode :
3861930
Title :
Modeling contact between rigid sphere and elastic layer bonded to rigid substrate
Author :
M. Stevanovic;M.M. Yovanovich;J.R. Culham
Author_Institution :
C-MAC Eng., Ottawa, Ont., Canada
Volume :
24
Issue :
2
fYear :
2001
Firstpage :
207
Lastpage :
212
Abstract :
An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
Keywords :
"Bonding","Thermal resistance","Thermal conductivity","Immune system","Contact resistance","Electronic packaging thermal management","Resistance heating","Predictive models","Electrical resistance measurement","Thermal stresses"
Journal_Title :
IEEE Transactions on Components and Packaging Technologies
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.926384
Filename :
926384
Link To Document :
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