• DocumentCode
    3862057
  • Title

    Steady state analysis of cooling electronic circuits using heat pipes

  • Author

    J. Legierski;B. Wiecek

  • Author_Institution
    Inst. of Electron., Tech. Univ. Lodz, Poland
  • Volume
    24
  • Issue
    4
  • fYear
    2001
  • Firstpage
    549
  • Lastpage
    553
  • Abstract
    This paper presents simulation of new cooling fins equipped with heat pipes for high power and high temperature electronic circuits and devices. Highly conductive heat pipe provides more effective energy dissipation to the ambient. Calculated thermal resistance shows quantitatively the improvement of cooling conditions for fins with heat pipe in comparison to traditional device.
  • Keywords
    "Steady-state","Electronics cooling","Electronic circuits","Heat transfer","Heat sinks","Thermal conductivity","Temperature","Circuit simulation","Electronic packaging thermal management","Thermal force"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.974941
  • Filename
    974941
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3862057