DocumentCode
3862333
Title
Evolution of Interconnects and Packaging
fYear
2005
fDate
6/5/2016 12:00:00 AM
Firstpage
1
Lastpage
1
Keywords
"Packaging","Integrated circuit interconnections","Routing","Signal processing","Physical layer","Printed circuits","Clocks","Drives","Process design","Signal design"
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Print_ISBN
0-7803-9292-2
Type
conf
DOI
10.1109/HDP.2005.251428
Filename
4017469
Link To Document