DocumentCode
3863131
Title
[Front matter]
fYear
2015
Abstract
The following topics are dealt with: power integrity; advanced simulation techniques; electromagnetics; student software demonstration; RF modeling and design techniques; advanced packaging technologies and techniques; advanced macromodeling and simulation; high-speed channel characterization; and high-speed link design.
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
Print_ISBN
978-1-5090-0038-8
Type
conf
DOI
10.1109/EPEPS.2015.7347114
Filename
7347114
Link To Document