Title :
An electromagnetic model for back-drilled vias
Author :
Aosheng Rong;Andreas C. Cangellaris;Feng Ling
Author_Institution :
Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 306 N. Wright St., 61801, U.S.A.
Abstract :
The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.
Keywords :
"Mathematical model","Substrates","Scattering","Metallization","Apertures","Electromagnetic modeling","Electromagnetics"
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
Print_ISBN :
978-1-5090-0038-8
DOI :
10.1109/EPEPS.2015.7347127
