DocumentCode :
38644
Title :
A Multi-Mode Multi-Band Reconfigurable Power Amplifier for 2G/3G/4G Handset Applications
Author :
Sungyoon Kang ; Unha Kim ; Junghyun Kim
Author_Institution :
Dept. of Electron. & Syst. Eng., Hanyang Univ., Ansan, South Korea
Volume :
25
Issue :
1
fYear :
2015
fDate :
Jan. 2015
Firstpage :
49
Lastpage :
51
Abstract :
Fully-integrated multi-mode multi-band (MMMB) reconfigurable power amplifier (PA) is implemented using single PA-cores for high- and low-frequency bands, respectively. This PA has five output paths and covers quad-band Gaussian Minimum Shift Keying/Enhanced Data Rates for Global Evolution and penta-band Universal Mobile Telecommunications System/Long Term Evolution mode operation with band combination in a small form-factor. To optimize the PA, the proposed structure reconfigures the PA-core cells as well as the interstage/output matching network. When compared with the single-mode single-band dedicated PAs, the fabricated PA showed comparable RF performance for all modes and bands, except for PAE degradations of 3.1% and 1.9% for high- and low-band, respectively, thus validating the usefulness of the proposed structure for MMMB PA applications.
Keywords :
3G mobile communication; Long Term Evolution; minimum shift keying; mobile handsets; radiofrequency power amplifiers; 2G-3G-4G handset; Long Term Evolution mode; MMMB PA; efficiency 1.9 percent; efficiency 3.1 percent; enhanced data rates; fully-integrated multimode multiband reconfigurable power amplifier; global evolution-penta-band universal mobile telecommunications system; high-frequency bands; interstage-output matching network; low-frequency bands; quad-band Gaussian minimum shift keying; single PA-core cell; single-mode single-band dedicated PAs; small form-factor; 3G mobile communication; Broadband communication; Degradation; Impedance matching; MMICs; Power generation; Telephone sets; Multi-band; multi-mode; penta-band UMTS/LTE; quad-band GMSK/EDGE; reconfigurable power amplifier (PA); single PA-core;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2014.2367164
Filename :
6954521
Link To Document :
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