Heavy ion characterization of SEU mitigation methods for the Virtex FPGA

Author

Sturesson, F. ; Mattsson, S. ; Carmichael, C. ; Harboe-Sorensen, R.

Author_Institution

Saab Ericsson Space, Goteborg, Sweden

fYear

2001

fDate

10-14 Sept. 2001

Firstpage

285

Lastpage

291

Abstract

This work presents the results from heavy ion tests of Xilinx Virtex FPGA XQVR300 manufactured by Xilinx in a 0.25μm technology. Virtex XQVR300 is an SRAM-based FPGA, which allows for real-time reconfigurable computing. Reprogrammable logic would offer the benefit of on-orbit design changes. Earlier SEU testing on this type of device has reported high sensitivity to heavy ions. Mitigation techniques of single event upsets in Virtex devices as triple module redundancy (TMR) and configuration readback (bitstream repair) have been developed by Xilinx and are tested in this work.

Keywords

SRAM chips; field programmable gate arrays; integrated circuit reliability; ion beam effects; redundancy; space vehicle electronics; 0.25 micron; SEU mitigation methods; SRAM-based FPGA; TMR; Virtex FPGA XQVR300; bitstream repair; configuration readback; heavy ion characterization; single event upsets; space electronics; triple module redundancy; Circuit testing; Field programmable gate arrays; Filters; Flip-flops; Logic devices; Plastics; Redundancy; Registers; Single event upset; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Radiation and Its Effects on Components and Systems, 2001. 6th European Conference on

Print_ISBN

0-7803-7313-8

Type

conf

DOI

10.1109/RADECS.2001.1159294

Filename

1159294