• DocumentCode
    387430
  • Title

    Membrane-based photonic crystal light sources

  • Author

    Viktorovitch, P. ; Monat, Christelle ; Seassal, Christian ; Letartre, Xavier ; Regreny, P. ; Rojo-Romeo, P. ; Cassagne, D. ; Albert, J.P.

  • Author_Institution
    LEOM, Ecole Centrale de Lyon, Ecully, France
  • Volume
    2
  • fYear
    2002
  • fDate
    10-14 Nov. 2002
  • Firstpage
    675
  • Abstract
    Summary form only given. Highly compact microlasers integrated on silicon, emitting in the 1.3-1.6 μm range are important building blocks for future photonic integrated circuits that could be developed for applications such as optical interconnects. In-plane emission and low threshold are desirable for these devices, to be compatible with dense photonic integration. In this paper, we report on the fabrication of InP membrane laser micro-sources integrated on a silicon wafer, based on 2D Photonic Crystal (PC) structures. The PC consists of a triangular lattice of holes formed in the thin membrane. The basic integration procedure includes wafer scale InP transfer onto silicon via SiO2-SiO2 bonding and conventional nanofabrication technologies.
  • Keywords
    III-V semiconductors; distributed feedback lasers; indium compounds; integrated optics; membranes; microcavity lasers; nanotechnology; photoluminescence; photonic crystals; quantum well lasers; 1.3 to 1.6 micron; 2D DFB effect; 2D photonic crystal structures; InAsP-InP; InAsP/InP quantum well heterostructures; InP membrane laser micro-sources; InP-SiO2-Si; PL spectrum; Si; SiO2-SiO2 bonding; dense photonic integration; highly compact microlasers; in-plane emission; integration procedure; low threshold; membrane-based photonic crystal light sources; microcavity lasers; nanofabrication technologies; optical interconnects; photonic integrated circuits; silicon wafer; triangular hole lattice; wafer scale InP transfer; Biomembranes; Indium phosphide; Lattices; Light sources; Optical device fabrication; Optical interconnections; Photonic crystals; Photonic integrated circuits; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2002. LEOS 2002. The 15th Annual Meeting of the IEEE
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-7500-9
  • Type

    conf

  • DOI
    10.1109/LEOS.2002.1159486
  • Filename
    1159486