DocumentCode :
387612
Title :
Implicit treatment of substrate and power-ground losses in return-limited inductance extraction
Author :
Sitaram, Dipak ; Zheng, Yu ; Shepard, K.L.
Author_Institution :
Cadence Design Syst., New Providence, NJ, USA
fYear :
2002
fDate :
10-14 Nov. 2002
Firstpage :
16
Lastpage :
22
Abstract :
Full-wave analysis, based on rigorous solution of the differential or integral form of Maxwell´s equations, is too slow for all but the smallest designs. Traditional on-chip extraction engines are, therefore, being pushed to extract inductance and provide accurate high frequency interconnect modelling while maintaining computational efficiency and capacity. This paper describes further accuracy-improving enhancements to the commercial full-chip RLCK extraction engine, Assura RLCX, based on the return-limited inductance formulation. Specifically, we incorporate substrate losses due to eddy currents and power-ground losses while, based on design-driven assumptions, avoiding explicit extraction of the power-ground and substrate. Results are validated on small testcases where comparison with full-wave solutions is practical.
Keywords :
circuit CAD; circuit simulation; eddy current losses; inductance; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; ladder networks; logic CAD; logic simulation; Assura RLCX; Maxwell equations differential/integral forms; computational efficiency/capacity; eddy current substrate losses; frequency interconnect modelling; full-chip RLCK extraction engines; full-wave analysis; high-frequency interconnect analysis; ladder networks; on-chip inductance extraction engines; power-ground losses; return-limited inductance extraction; return-limited inductance formulation; substrate losses; Capacitance; Conductors; Coupling circuits; Engines; Frequency; Inductance; Integral equations; Integrated circuit interconnections; Maxwell equations; Microwave theory and techniques;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Aided Design, 2002. ICCAD 2002. IEEE/ACM International Conference on
ISSN :
1092-3152
Print_ISBN :
0-7803-7607-2
Type :
conf
DOI :
10.1109/ICCAD.2002.1167508
Filename :
1167508
Link To Document :
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