Title :
Repeatedly Bendable Paper Touch Pad via Direct Stamping of Silver Nanoink With Pressure-Induced Low-Temperature Annealing
Author :
Jiseok Kim ; Jong, Jimmy H. ; Woo Soo Kim
Author_Institution :
SFU Stretchable Devices Lab., Simon Fraser Univ., Surrey, BC, Canada
Abstract :
We report fabrication of mechanically bendable touch sensor pads by direct stamping of nanoinks with silver nanoparticles (AgNPs) dispersed in an organic solvent. Direct stamping lowers annealing temperature of silver nanoparticles and enhances mechanical flexibility. The directly stamped silver electrode reaches the silver nanoink´s final conductivity at lower annealing temperature, 130 °C, than the As-sprayed silver electrode. And also the directly stamped silver electrodes have much lower resistance than the As sprayed one even before annealing of AgNPs. In addition, the touch sensor pads fabricated by direct stamping shows no significant decrease in sensitivity even after repeated bending stroke test at 1 Hz for 10 000 cycles. These results of mechanical stability and low annealing temperature are possible because the compressive force, which is applied to the AgNPs inside the trenches of a stamp during the direct stamping process, induces removal of pores between neighboring AgNPs, and subsequent, densification of the layers of AgNPs.
Keywords :
annealing; bending; electrodes; metal stamping; nanoparticles; silver; tactile sensors; Ag; compressive force; direct stamping process; directly stamped silver electrode; frequency 1 Hz; mechanical flexibility; mechanical stability; mechanically bendable touch sensor pad fabrication; nanoink direct stamping; neighboring silver nanoparticles; organic solvent; pore removal; pressure-induced low-temperature annealing; repeated bending stroke test; repeatedly bendable paper touch pad; silver nanoink conductivity; silver nanoparticle annealing; silver nanoparticle layer densification; sprayed silver electrode; stamp trenches; temperature 130 degC; Annealing; Capacitance; Electrodes; Force; Ink; Silver; Substrates; Direct stamping; flexible electronics; low-temperature annealing; silver nanoparticle; touch pad;
Journal_Title :
Nanotechnology, IEEE Transactions on
DOI :
10.1109/TNANO.2013.2281326