• DocumentCode
    389326
  • Title

    New approach to vision-based BGA package inspection

  • Author

    Yu, Mei ; Jiang, Gang-Yi ; He, Sai-Long ; Yu, Bo-Kang ; Fu, Ran-Di

  • Author_Institution
    Inst. of Circuits & Syst., Ningbo Univ., China
  • Volume
    2
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    1107
  • Abstract
    Ball grid array (BGA) techniques have developed very fast due to the advantages of more I/O ports, small size, and so on. In this paper, a vision-based algorithm for BGA package inspection is proposed to accurately estimate center and diameters of solder-balls of BGA packages, so that defects of BGA packages, such as missing or extra balls, oversize or undersize balls, over-height or under-height balls, and pitch can be detected for ensuring the quality of BGA packages.
  • Keywords
    automatic optical inspection; ball grid arrays; computer vision; feature extraction; 2D inspection; 3D inspection; BGA package inspection; ball grid array; defect detection; feature extraction; vision-based algorithm; Cameras; Circuits and systems; Electronics packaging; Helium; Inspection; Laboratories; Packaging machines; Pixel; Sensor systems; X-ray lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Machine Learning and Cybernetics, 2002. Proceedings. 2002 International Conference on
  • Print_ISBN
    0-7803-7508-4
  • Type

    conf

  • DOI
    10.1109/ICMLC.2002.1174556
  • Filename
    1174556
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=389326