Signal integrity simulation and analysis in high-speed interconnects by using FDTD

With the advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and applications of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering become an emerging technology. Termination, via, and crosstalk on interconnection lines will raise EMI problems in high-speed circuits and will therefore require more attention during the design phase for signal integrity. This paper presents signal propagation effect analysis on high-speed interconnection lines, between different parts, with the finite-difference time-domain method. The mechanisms and effectiveness of control measures are examined, which could be applied to high-speed circuit design.