Title :
Defining the future for microprocessor power delivery
Author :
Lidow, Alex ; Sheridan, Gene
Author_Institution :
Int. Rectifier Corp., El Segundo, CA, USA
Abstract :
This presentation gives a brief overview of the primary technical challenges confronting power management for the computing, and information technology world in general, and then discusses several technology advances that are anticipated. More specifically, the paper discusses innovations in power semiconductor processes and device design; changes in architecture and thermal management and the emergence of integrated solutions that will be needed to meet these power management challenges.
Keywords :
computer power supplies; thermal management (packaging); PWM controller; building block integration; control architectures; iPOWIR; microprocessor power delivery; power management; power packaging; power semiconductor device design; power semiconductor processes; power silicon; thermal management; Computer architecture; Disaster management; Energy management; Information technology; Innovation management; Microprocessors; Process design; Technological innovation; Technology management; Thermal management;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE
Conference_Location :
Miami Beach, FL, USA
Print_ISBN :
0-7803-7768-0
DOI :
10.1109/APEC.2003.1179168
