Defining the future for microprocessor power delivery

Author

Lidow, Alex ; Sheridan, Gene

Author_Institution

Int. Rectifier Corp., El Segundo, CA, USA

Volume

1

fYear

2003

fDate

9-13 Feb. 2003

Firstpage

3

Abstract

This presentation gives a brief overview of the primary technical challenges confronting power management for the computing, and information technology world in general, and then discusses several technology advances that are anticipated. More specifically, the paper discusses innovations in power semiconductor processes and device design; changes in architecture and thermal management and the emergence of integrated solutions that will be needed to meet these power management challenges.

Keywords

computer power supplies; thermal management (packaging); PWM controller; building block integration; control architectures; iPOWIR; microprocessor power delivery; power management; power packaging; power semiconductor device design; power semiconductor processes; power silicon; thermal management; Computer architecture; Disaster management; Energy management; Information technology; Innovation management; Microprocessors; Process design; Technological innovation; Technology management; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE

Conference_Location

Miami Beach, FL, USA

Print_ISBN

0-7803-7768-0

Type

conf

DOI

10.1109/APEC.2003.1179168

Filename

1179168