Title :
Trends and drivers in isolated board-mounted DC/DC products for communications applications
Author :
Sayani, Mahmoud P. ; Wanes, John
Author_Institution :
Celestica Inc, Toronto, Ont., Canada
Abstract :
The last few years have seen an acceleration in product development in isolated, board-mount DC/DC products for communications applications. This paper explores the drivers in the end market, trends in packaging and parameters in BMP development and identifies the challenges in continuing these trends.
Keywords :
DC-DC power convertors; telecommunication power supplies; thermal management (packaging); board mounted power; communications applications; end market drivers; isolated board-mounted DC/DC products; packaging; product development; thermal management; Acceleration; Bandwidth; Communication switching; Communications technology; DC-DC power converters; DSL; Optical fiber devices; Packaging; Power systems; Voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE
Conference_Location :
Miami Beach, FL, USA
Print_ISBN :
0-7803-7768-0
DOI :
10.1109/APEC.2003.1179173
