Title :
A mixed abstraction level co-simulation case study using SystemC for system on chip verification
Author :
Sayinta, Ali ; Canverdi, Gorkem ; Pauwels, Marc ; Alshawa, Amer ; Dehaene, Wim
Author_Institution :
STMicroelectronics, Istanbul, Turkey
Abstract :
This paper focuses on co-simulation scenarios and their applications as a part of a system-on-chip (SoC) modeling and design methodology developed at Alcatel Microelectronics (now part of STMicroelectronics) within a wireless local area network (LAN) SoC project. This methodology proposes to build a SystemC-based executable model of the system to maintain a bridge between the algorithmic and the implementation worlds. The model is used in later phases by means of co-simulation of SystemC, HDL and firmware. SystemC-HDL co-simulation scenario provides a way of checking inter-operability of a single designed HW module with the SystemC model. The SystemC-instruction set simulator (ISS) co-simulation provides a platform to develop and verify the firmware that will run on the selected processor core even before the HW modules are designed. It is shown that, with sufficient tool support, these design stages reduce the complexity of the SoC design and improve the debugging capabilities.
Keywords :
firmware; formal verification; hardware description languages; hardware-software codesign; logic design; logic simulation; open systems; program debugging; software tools; system-on-chip; wireless LAN; HDL; SoC debugging; SoC design; SoC modeling; SystemC-based executable model; SystemC-instruction set simulator; co-simulation tool support; firmware; hardware module interoperability; mixed abstraction level co-simulation; processor core; system on chip verification; wireless LAN; wireless local area network; Bridges; Computer aided software engineering; Design methodology; Mathematical model; Microprogramming; OFDM; Physical layer; System testing; System-on-a-chip; Wireless LAN;
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition, 2003
Print_ISBN :
0-7695-1870-2
DOI :
10.1109/DATE.2003.1186678