DocumentCode :
392003
Title :
Development of software package for the design of high-performance vacuum devices
Author :
Hwu, RueyJen ; Ren, Jishi ; Sadwick, L.P. ; Chen, Kuan
Author_Institution :
InnoSys, Inc., Salt Lake City, UT, USA
fYear :
2002
fDate :
17-19 Aug. 2002
Firstpage :
182
Lastpage :
185
Abstract :
This paper reports on our work and progress in the simulation and design of the high-performance vacuum devices. Miniaturization and easy manufacturing of vacuum devices have been of interest to the research community of vacuum electronics. The goal of this work is both to explore the performance limits of and to develop necessary design tool for the high-performance vacuum devices that utilize advanced manufacturing techniques. As a result, our simulation and modeling package for the design of the high-performance vacuum devices consists of all three of electromagnetic, structural, and thermal analyses. In this paper, we report on the findings and results of our development of the simulation and modeling package for the design of the high-performance vacuum devices. Electrical characteristics and performance of the vacuum devices are highly geometry dependent. The electromagnetic analysis of these devices is accompanied by mechanical, i.e., structural and thermal, analyses in our simulation and modeling package.
Keywords :
electronic design automation; semiconductor device models; thermal analysis; vacuum microelectronics; design tool; electromagnetic analyses; geometry; high-performance vacuum devices; modeling package; software package; structural analyses; thermal analyses; vacuum electronics; Analytical models; Electric variables; Electromagnetic analysis; Electromagnetic devices; Electromagnetic modeling; Electronic packaging thermal management; Geometry; Manufacturing; Software packages; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002. 2002 3rd International Conference on
Print_ISBN :
0-7803-7486-X
Type :
conf
DOI :
10.1109/ICMMT.2002.1187665
Filename :
1187665
Link To Document :
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