Title :
Reliability of the SnBi lead finished Pb-free produet
Author :
Park, Ki-Hwan ; Kim, Nam-Seog ; Oh, Se-Yong
Author_Institution :
Samsung Electronics Co. LTD.
Keywords :
Belts; Bismuth; Current density; Electronics packaging; Lead; Morphology; Size control; Temperature control; Tin; Weight control;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188829
