SAW signal processing: extendable by Si-ASICs?

SAW devices store signal energy contained in acoustic waves for a relatively long time T. Appropriate design of interdigital transducers (IDTs) for a selectable-, bandwidth B and signal shape yields unique signal processing (SP) devices: resonators and band pass filters, with high selectivity on the one hand, and a variety of devices for SP applications with high processing gain G=TB on the other (e.g., dispersive filters, convolvers, wirelessly readable identification tags, and sensors). In the course of mass production recently flip chip technology became applicable to SAW devices. Using this technology for bonding SAW devices onto a silicon application specific integrated circuit (Si-ASIC) hybrid SP solutions will be feasible which contain both the high process gain G of SAW devices and the programmability and electrical circuit optimization of mixed mode ASICs combining analogous and digital SP. We present principles of operation and applications of extended hybrid SAW-ASICs for flexible systems.