Title :
Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees
Author :
Gan, Chee Lip ; Thompson, Carl V. ; Pey, Kin Leong ; Choi, Wee Kiong ; Chang, Choon Wai ; Guo, Qiang
Author_Institution :
Singapore-MIT Alliance, Singapore, Singapore
fDate :
30 March-4 April 2003
Abstract :
While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for Al.
Keywords :
copper; current distribution; electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; Cu; Cu metallization; current distribution; dual-damascene via; electromigration; failure time distribution; multi-terminal Cu dual-damascene interconnect trees; reliability; stressed segments; Artificial intelligence; Copper; Current density; Current distribution; Drives; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Metallization; Reliability engineering;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197822
