DocumentCode
396265
Title
A modular sensor microsystem utilizing a universal interface circuit
Author
Mason, A. ; Yazdi, N. ; Zhang, J. ; Sainudeen, Z.
Author_Institution
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Volume
3
fYear
2003
fDate
25-28 May 2003
Abstract
The performance features of MEMS transducers allow the development of a new class of small, low-power sensor microsystems which utilize a suite of sensors to support a wide range of applications. This paper presents a system-level framework for constructing such microsystems where system modularity for application adaptability is a primary design consideration. System architecture, communication protocols, modular packaging, and interface electronics are discussed in general terms, and an implementation of these concepts is presented. Key requirements for microsystem modularity, such as a communication bus and a universal microsensor interface circuit which support plug-n-play operation for online reconfiguration, are developed and presented in this paper.
Keywords
low-power electronics; microsensors; MEMS transducer; communication bus; communication protocol; interface electronics; low-power microsensor; modular packaging; modular sensor microsystem; online reconfiguration; plug-n-play operation; system architecture; universal microsensor interface circuit; Circuits; Communication system control; Control systems; Electronics packaging; Intelligent sensors; Micromechanical devices; Microsensors; Protocols; Sensor phenomena and characterization; Sensor systems and applications;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium on
Print_ISBN
0-7803-7761-3
Type
conf
DOI
10.1109/ISCAS.2003.1205172
Filename
1205172
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