Title :
The role of laminate, LTCC, and silicon based approaches to system in package development
Author :
Law, E. ; Kossives, D.P. ; Bailey, K. ; Sahakian, D. ; Ling, J. ; Emigh, R.
Author_Institution :
ST Assembly & Test Services Inc., Tempe, AZ, USA
Abstract :
As the wireless industry continues to advance, demand for further system miniaturization, cost reduction, improved performance, and reliability are increasing. Several new substrate technology solutions have shown the potential to successfully integrate the passive components. Each of these solutions has advantages, disadvantages, and limitations. A Power Amplifier (PA) case study was conducted to compare the benefits and drawbacks between the laminate, ceramic and high resistivity silicon substrates.
Keywords :
ceramic packaging; ceramics; cost reduction; elemental semiconductors; laminates; reliability; silicon; LTCC; Si; cost reduction; laminate; package development system; passive components; power amplifier; silicon substrates; substrate technology; system miniaturization; wireless industry; Ceramics; Conductivity; Costs; Dielectric constant; Dielectric losses; Dielectric substrates; Laminates; Packaging; Routing; Silicon;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
Print_ISBN :
0-7803-7933-0
DOI :
10.1109/IEMT.2003.1225909
