• DocumentCode
    397169
  • Title

    Step-based facet interactions in wet anisotropic etching

  • Author

    Stateikina, I. ; Elalamy, Z. ; Landsberger, L.M. ; Kahrizi, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
  • Volume
    1
  • fYear
    2003
  • fDate
    4-7 May 2003
  • Firstpage
    137
  • Abstract
    Recent experimental data has shown that a model of wet anisotropic etching of silicon must not be solely based on the crystal features presented to the etchant. The boundaries of under-etched facets, and step interaction at those boundaries, are also likely to play a role in determining etch rates. This work examines the behaviour of a particular configuration of steps, where both are composed of atoms having two dangling bonds, and where they intersect at an angle of 90°, at a junction between two adjacent under etched facets.
  • Keywords
    elemental semiconductors; etching; silicon; Si; crystal features; dangling bonds; etch rates; etchant; silicon; wet anisotropic etching; Anisotropic magnetoresistance; Electron optics; Electronic mail; Micromechanical devices; Optical microscopy; Scanning electron microscopy; Silicon; Surface morphology; Temperature; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2003. IEEE CCECE 2003. Canadian Conference on
  • ISSN
    0840-7789
  • Print_ISBN
    0-7803-7781-8
  • Type

    conf

  • DOI
    10.1109/CCECE.2003.1226362
  • Filename
    1226362