DocumentCode :
397169
Title :
Step-based facet interactions in wet anisotropic etching
Author :
Stateikina, I. ; Elalamy, Z. ; Landsberger, L.M. ; Kahrizi, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
Volume :
1
fYear :
2003
fDate :
4-7 May 2003
Firstpage :
137
Abstract :
Recent experimental data has shown that a model of wet anisotropic etching of silicon must not be solely based on the crystal features presented to the etchant. The boundaries of under-etched facets, and step interaction at those boundaries, are also likely to play a role in determining etch rates. This work examines the behaviour of a particular configuration of steps, where both are composed of atoms having two dangling bonds, and where they intersect at an angle of 90°, at a junction between two adjacent under etched facets.
Keywords :
elemental semiconductors; etching; silicon; Si; crystal features; dangling bonds; etch rates; etchant; silicon; wet anisotropic etching; Anisotropic magnetoresistance; Electron optics; Electronic mail; Micromechanical devices; Optical microscopy; Scanning electron microscopy; Silicon; Surface morphology; Temperature; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Computer Engineering, 2003. IEEE CCECE 2003. Canadian Conference on
ISSN :
0840-7789
Print_ISBN :
0-7803-7781-8
Type :
conf
DOI :
10.1109/CCECE.2003.1226362
Filename :
1226362
Link To Document :
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