Identification of microwave device and packaging models from frequency response data

As system integration evolves and package densities increases, it becomes increasingly important to model non-ideal behavior of previously neglected frequency-domain effects of the microwave components and packaging interconnects. This paper addresses the generation of SPICE-based circuit models from frequency-domain response parameters. In particular, a recently developed subspace identification algorithm is applied to generate passive multi-port models of microwave devices and packages characterized by measured or simulated network parameters. Results of the application of the proposed method applied to real-world examples are given.