• DocumentCode
    397464
  • Title

    Verification of multi-functional vertical furnace

  • Author

    Oka, Shuichi ; Ishii, Kazuki ; Ito, Takao ; Shinohara, Toshiko ; Mikata, Y.

  • Author_Institution
    Halca Project, Assoc.of Super-Adv. Electron. Technol., Tsukuba, Japan
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    400
  • Lastpage
    403
  • Abstract
    We verify multi-functional mini-batch vertical furnace. The mini-batch furnace, which was proposed, based on Agile Fab concept, should form different kinds of films alternately and have short RPT (raw process time). When the process recipes, such as TEOS, SiN and Poly-Si deposition and thermal oxide, are optimized, all RPTs dramatically reduce and achieve to be shorter than 1 hour. When different kinds of films are alternately formed in single chamber, process stability of film formation is excellent. In case of SiN and TEOS, triple relative standard deviations (RSDs) of growth rate are less than 5% and averages of particulate (more than 0.2 um) are fewer than 15. In case of thermal oxide and Poly-Si, triple RSDs of film thickness are less than 5% and averages of particulate are fewer than 10. Furthermore, it is demonstrated that the quality of thermal oxide film formed by the multi-functional tool is equivalent to that formed by conventional tool. We develop and realize the mini-batch furnace based on Agile Fab concept.
  • Keywords
    agile manufacturing; batch processing (industrial); chemical vapour deposition; elemental semiconductors; furnaces; integrated circuit manufacture; organic compounds; production equipment; semiconductor thin films; silicon; silicon compounds; wide band gap semiconductors; Si; Si film; SiN; SiN film; SiO2; TEOS; agile fab concept; multifunctional vertical furnace; raw process time; thermal oxide film; triple relative standard deviation; Consumer electronics; Costs; Furnaces; Indium tin oxide; Semiconductor device manufacture; Semiconductor films; Silicon compounds; Smoothing methods; Stability; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243312
  • Filename
    1243312