DocumentCode :
397464
Title :
Verification of multi-functional vertical furnace
Author :
Oka, Shuichi ; Ishii, Kazuki ; Ito, Takao ; Shinohara, Toshiko ; Mikata, Y.
Author_Institution :
Halca Project, Assoc.of Super-Adv. Electron. Technol., Tsukuba, Japan
fYear :
2003
fDate :
30 Sept.-2 Oct. 2003
Firstpage :
400
Lastpage :
403
Abstract :
We verify multi-functional mini-batch vertical furnace. The mini-batch furnace, which was proposed, based on Agile Fab concept, should form different kinds of films alternately and have short RPT (raw process time). When the process recipes, such as TEOS, SiN and Poly-Si deposition and thermal oxide, are optimized, all RPTs dramatically reduce and achieve to be shorter than 1 hour. When different kinds of films are alternately formed in single chamber, process stability of film formation is excellent. In case of SiN and TEOS, triple relative standard deviations (RSDs) of growth rate are less than 5% and averages of particulate (more than 0.2 um) are fewer than 15. In case of thermal oxide and Poly-Si, triple RSDs of film thickness are less than 5% and averages of particulate are fewer than 10. Furthermore, it is demonstrated that the quality of thermal oxide film formed by the multi-functional tool is equivalent to that formed by conventional tool. We develop and realize the mini-batch furnace based on Agile Fab concept.
Keywords :
agile manufacturing; batch processing (industrial); chemical vapour deposition; elemental semiconductors; furnaces; integrated circuit manufacture; organic compounds; production equipment; semiconductor thin films; silicon; silicon compounds; wide band gap semiconductors; Si; Si film; SiN; SiN film; SiO2; TEOS; agile fab concept; multifunctional vertical furnace; raw process time; thermal oxide film; triple relative standard deviation; Consumer electronics; Costs; Furnaces; Indium tin oxide; Semiconductor device manufacture; Semiconductor films; Silicon compounds; Smoothing methods; Stability; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN :
1523-553X
Print_ISBN :
0-7803-7894-6
Type :
conf
DOI :
10.1109/ISSM.2003.1243312
Filename :
1243312
Link To Document :
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