Title :
Reduction of AlF3 and ALFO defects by replacing aluminum purge ring heaters with ceramic purge ring heaters in AMAT tungsten CVD systems
Author :
Sidhwa, A. ; Goulding, M. ; Gandy, Tobias
Author_Institution :
STMicroelectron. Inc., Phoenix, AZ, USA
fDate :
30 Sept.-2 Oct. 2003
Abstract :
One style of heater used within an Applied Materials (AMAT) Tungsten Chemical Vapor Deposition (WCVD) chamber comprises both the heater and integral (outer) purge-ring made of Aluminum (Al); such heater units are designated Rev-G, and the chamber, WxZ. In this work, the degradation and collapse (thermal fatigue) of the Al purge-ring has been studied at different stages in the lifetime of a Rev-G heater in a Centura (5200) WCVD system, together with its influence on W film defectivity. It is shown that the manufacture of such heaters (using a high temperature forging method) has a significant impact upon both the defectivity levels and thickness uniformity of the subsequently deposited tungsten films; i.e., it has been reported by AMAT that heaters containing an excess of β-phase Al grains, compared with α-phase, can induce significant levels of AlF3 (Aluminum Fluoride) and AlFO (Aluminum, Fluorine, and Oxygen) defects into the deposited films. The defect generation is basically due to the attack of the β-phase Al grains by fluorine ions during the "periodic (plasma) clean " part of the cycle, where NF3 gas is used to clean the chamber/components after a specific number of wafers have been deposited. It was observed that the degradation in the defect performance and thickness uniformity started to occur after the deposition of a few thousand wafers. A temporary solution to the uniformity issue was to adjust the deposition edge-purge (H2+Ar) gas flows; however, the entire problem was solved by replacing the Rev-G heaters with alternative "Ceramic Purge-Ring" (CPR) heaters. The latter comprised a (removable) ceramic purge-ring in place of the integral Al purge-ring of the Rev-G heater; such chambers are designated WxZ+.
Keywords :
aluminium; aluminium compounds; chemical vapour deposition; fluorine; forging; grain size; metallic thin films; oxygen; thermal stress cracking; tungsten; Al; Al grains; AlF3; F; NF3 gas; O; W; W film defectivity; aluminum fluoride; applied materials; ceramic purge ring heaters; defect generation; degradation; deposition edge purge gas flow; fluorine defects; fluorine ions; high temperature forging method); oxygen defects; periodic plasma clean; thermal fatigue; tungsten CVD systems; tungsten chemical vapor deposition chamber; Aluminum; Ceramics; Chemical vapor deposition; Fatigue; Manufacturing; Noise measurement; Oxygen; Plasma temperature; Thermal degradation; Tungsten;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243317