Process monitoring via independent components

Author

Shannon, Thaddeus T. ; Abercrombie, David ; McNames, James

Author_Institution

Syst. Sci. Program, Portland State Univ., OR, USA

Volume

4

fYear

2003

fDate

5-8 Oct. 2003

Firstpage

3496

Abstract

We propose a method for process monitoring of a semiconductor manufacturing process. Independent component analysis (ICA) is applied to characterize E-test parameter data. We calculate angular confidence intervals for the model, eliminate marginally significant components and implement control charts for significant components of interest. Alarms are generated off of deviations in the charted components. Alarms are easily used in process diagnosis based on the interpretation of the independent components.

Keywords

control charts; independent component analysis; parameter estimation; process monitoring; semiconductor device manufacture; statistical process control; E-test parameter data; Independent component analysis; alarms; angular confidence intervals; control charts; independent components; process diagnosis; process monitoring; semiconductor manufacturing process; statistical process control; Circuit testing; Computerized monitoring; Independent component analysis; Manufacturing processes; Mutual information; Principal component analysis; Process control; Production; Random variables; Semiconductor device manufacture;

fLanguage

English

Publisher

ieee

Conference_Titel

Systems, Man and Cybernetics, 2003. IEEE International Conference on

ISSN

1062-922X

Print_ISBN

0-7803-7952-7

Type

conf

DOI

10.1109/ICSMC.2003.1244430

Filename

1244430