Modeling and high frequency characterization of short links for high performance integrated circuits. Experimental validation and CAD formulas

Author

Hassaïne, N. ; Concilio, F.

Author_Institution

Microwave Commun. Div., Harris Corp., Dollard-des-Ormeaux, Que., Canada

Volume

1

fYear

2003

fDate

20-23 Sept. 2003

Firstpage

507

Abstract

This study investigates the computing of the inductance of short links (gold wires connections). The [L] matrix calculations are performed with the potential vector given in an integral form, taking into account the current density distribution on the conductors. The Partial Element Equivalent Circuit method (PEEC) is used for this calculation. Analytical formulas easy to use in CAD are derived from the numerical results using a least square method. The formulas have been shown a very good agreement, with a precision in the order of 4%, with simulation results and with experimental results obtained on test boards in the frequency range 1 - 30 GHz.

Keywords

UHF integrated circuits; circuit layout CAD; circuit simulation; current density; equivalent circuits; inductance; integrated circuit metallisation; lead bonding; microwave integrated circuits; CAD formulas; current density distribution; gold wire connections; high frequency characterization; high performance integrated circuits; inductance; matrix calculations; metallization wires; one wire bonding; parallel wire bondings; partial element equivalent circuit method; potential vector; short links; test boards; Circuit simulation; Conductors; Current density; Equivalent circuits; Frequency; Gold; Inductance; Integrated circuit modeling; Least squares methods; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics Conference, 2003. IMOC 2003. Proceedings of the 2003 SBMO/IEEE MTT-S International

Print_ISBN

0-7803-7824-5

Type

conf

DOI

10.1109/IMOC.2003.1244912

Filename

1244912