Title :
Reliability behavior of RF MEMS
Author :
Melle, S. ; Flourens, F. ; Dubuc, D. ; Grenier, K. ; Pons, P. ; Pressecq, F. ; Kuchenbecker, J. ; Muraro, J.L. ; Bary, L. ; Plana, R.
Author_Institution :
Lab. d´´Autom. et d´´Anal. des Syst., CNRS, Toulouse, France
fDate :
28 Sept.-2 Oct. 2003
Abstract :
This paper outlines the reliability properties of RF MEMS devices and circuits. The tools used to evaluate the reliability properties are presented. Results are shown on both moveable and non moveable devices. Key parameters that drive the reliability are pointed out: stress, roughness, temperature dependance, dielectric properties. Finally, it is presented some solutions to improve the reliability performance of these devices in term of technology and design.
Keywords :
contact resistance; micromechanical devices; semiconductor device reliability; surface roughness; MEMS circuits; MEMS devices; RF MEMS; dielectric properties; moveable devices; nonmoveable devices; reliability properties; roughness; stress; temperature dependance; Circuits; Dielectrics; Filters; Insertion loss; Micromechanical devices; Packaging; Radiofrequency microelectromechanical systems; Space technology; Stress; Switches;
Conference_Titel :
Semiconductor Conference, 2003. CAS 2003. International
Print_ISBN :
0-7803-7821-0
DOI :
10.1109/SMICND.2003.1251337
