Title :
Bringing optics inside the box: recent progress and future trends
Author :
Kash, J. ; Baks, C. ; Gowda, S. ; Graham, L. ; Hajimiri, A. ; Haymes, C. ; Jewell, J. ; Kucharski, D. ; Kuchta, D. ; Kwark, Y. ; Pepeljugoski, P. ; Schaub, J. ; Schuster, C. ; Tierno, Jose ; Wu, H.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Needs and requirements for optical interconnects in next generation servers are outlined. Related results on equalizing and characterizing high speed multimode links, building and testing parallel 12 × 10 Gbit/sec transceivers, and highly parallel silicon photodetectors are presented.
Keywords :
high-speed optical techniques; optical fabrication; optical fibre communication; optical interconnections; optical receivers; optical testing; optical transmitters; photodetectors; wavelength division multiplexing; 10 Gbit/s; WDM transceivers; device building; device testing; high speed multimode links; multimode link characterization; multimode link equalization; next generation servers; optical interconnects; parallel 12 × 10 Gbit/sec transceivers; parallel silicon photodetectors; Bandwidth; Copper; Costs; High speed optical techniques; Integrated circuit interconnections; Optical fiber LAN; Optical fibers; Optical filters; Optical interconnections; Transceivers;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1251644
